Alpha EF-2210TF is VOC-Free, halide-free, rosin/resin-free, low solids no-clean flux which provides the highest activity of any VOC-free Bellcore SIR compliant flux for defect-free soldering. It is formulated with a proprietary mixture of organic activators which deliver excellent wetting and top-side hole fill, even with OSP coated bare copper boards which have undergone prior thermal excursions. Several proprietary additives are also formulated into EF-2210TF which act to reduce the surface tension between the solder mask and the solder; thereby, dramatically reducing the tendency of solderball generation. The formulation of EF-2210TF is also designed to be more thermally stable; thereby, reducing the occurrence of solder bridging.